Adhesives Technology for Electronic Applications: Materials, Processes, Reliability is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures.

In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered.

More than 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Contents

Introduction

• Adhesives Types and Definitions
• Summary of Packaging Technologies
• History of Adhesives in Electronic Applications
• Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials
• Specifications
• The Market

Functions and Theory of Adhesives

• Mechanical Attachment
• Electrical Connections
• Thermal Dissipation
• Stress Dissipation

Chemistry, Formulation, and Properties of Adhesives

• Chemistry
• Formulation of Adhesives
• Properties

Adhesive Bonding Properties

• Cleaning
• Surface Treatments
• Adhesive Dispensing
• Placement of Devices and Components
• Curing
• Rework

Applications

• General Applications
• Specific Applications

Reliability

• Failure Modes and Mechanisms
• Specifications

Test and Inspection Methods

• Physical Tests
• Electrical Tests
• Environmental Tests
• Thermal Tests>
• Mechanical and Thermomechanical Tests
• Chemical Analysis

Appendix
Conversion Factors
Abbreviations and Acronyms
Index

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