This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.

The rise of cellular phones, PDAs, and palmtops has brought with it a host of new challenges for those charged with creating materials to meet those devices specifications. And now, thanks to the Electronic Materials and Processes Handbook, engineers have comprehensive coverage of the materials that cater to the microminiaturization trend in electronics.

This indispensable volume reflects the importance of engineering materials for thermal management system optimization and flexibility in microminiature sizes. It offers detailed discussions of a complete range of pertinent topics, including:

• Full material breakdowns for high-density packaging techniques
• Materials for communications wiring and cabling
• And much, much, more!

So, no matter if your work includes electronic packaging, fabrication, or assembly design, the Electronic Materials and Processes Handbook will help you master the growing demands of microminiaturization.

Contents

1. Development and Fabrication of IC Chips
2. Plastics, Elastomers, and Composites
3. Ceramics and Glasses
4. Metals
5. Solder Technologies for Electronic Packaging and Assembly
6. Electroplating and Deposited Metallic Coatings
7. Printed Circuit Board Fabrication
8. Materials and Processes for Hybrid Microelectronics and Multichip Modules
9. Adhestives Underfills, and Coatings in Electronics Assemblies
10. Thermal Management Materials and Systems

Index

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