From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics.

This thoroughly revised and expanded Fourth Edition adds new information on:

• key MEMs
• optoelectronic, single-chip, and high-speed technologies
• updates important chapters on ball grid array and flip chip technologies

Contents

1. Plastics, Elastomers, and Composites
2. Adhesives, Underfills, and Coatings
3. Thermal Management
4. Connector and Interconnection Technology
5. Solder Technologies for Electronic Packaging and Assembly
6. Packaging and Interconnection of Integrated Circuits
7. Hybrid Microelectronics and Multichip Modules
8. Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
9. Rigid and Flexible Printed Circuit Board Technology
10. Packaging of High-Speed and Microwave Electronic Systems

Index

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