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Engineering Book from C.H.I.P.S.

Materials for Rigid and Flexible Printed Wiring Boards
by Martin W. Jawitz

Materials for Rigid and Flexible Printed Wiring Boards presents important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials.

Features:

  • Collects data on all the appropriate materials for flexible and rigid printed wiring boards
  • Evaluates the properties and performance of materials to meet specific application requirements
  • Presents mainly typical values of material data gathered mostly from manufacturer's data sheets
  • Covers the materials used for each layer of a circuit board as well as the bonding materials and methods used to join them

Contents

Reinforcement Materials

  • Reinforcement Materials-Rigid
  • Glass
  • Glass Composition
  • Glass Fiber Manufacturing
  • From Yarn to Fabric
  • Glass Types and Construction
  • Glass Fabric Weave
  • Surfacing Mat, Paper or Veil
  • Glass Fiber Paper
  • Quartz
  • Properties of Glass Fabrics
  • Aramids
  • Constraining Dielectric Materials (Kevlar®)

Resins

  • Polyester Resin
  • Epoxy
  • Polyimide
  • Cyanate Ester and Cyanate Ester Blends (BT Resin)
  • Polyphenylene Oxide (PPO) Epoxy Blends
  • Polytetrafluoroethylene Resin (PTFE)

Flexible Films

  • Types of Flexible Materials
  • Adhesives
  • Cover Coat/Coverlay
  • Bondplies
  • Conductive Materials
  • Copper Clad Laminates

Copper Foils

  • Electrodeposited Copper Foil
  • Rolled Copper Foils
  • Grades
  • Nickel Foil

Laminates, Rigid

  • NEMA Grades
  • Composite Laminates
  • Rigid Laminates (Glass Reinforced)
  • Laminates, Rigid Glass Reinforced
  • Aramid Laminates
  • Prepreg
  • Additive Laminates

High-Speed/High Frequency Laminates

  • High-Speed/High-Frequency Laminates
  • Thin Laminates
  • Resins
  • High-Frequency Laminate Designations
  • Laminate Construction
  • Bonding
  • Dimensional Stability
  • Drilling

Metal Core and Constraining Core Materials

  • Copper-Invar-Copper (CIC)
  • Copper-Molybdenum-Copper (CMC)
  • Silicon Carbide Reinforced Aluminum (SiC/Al)
  • Coefficient of Thermal Expansion Trade-Offs (CTE)

Index

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Materials for Rigid and Flexible Printed
Wiring Boards

by Martin W. Jawitz
2006 • 169 pages • $138.95 + shipping
Texas residents please add 6.75 % sales tax

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