Modern Electroplating is the definitive resource for electroplating, now completely up to date!

This expanded new edition provides a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers.

With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject.

Modern Electroplating includes:

• Easily accessible, self-contained contributions by over thirty experts
• Five completely new chapters and hundreds of additional pages
• A cutting-edge look at applications in nanoelectronics
• Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM)
• An important discussion of the physical properties of metal thin films
• Chapters devoted to methods, tools, control, and environmental issues
• and much more

Contents

1. Fundamental Considerations
2. Electrodeposition of Copper
3. Electrodeposition of Nickel
4. Electrodeposition of Gold
5. Electroless and Electrodeposition of Silver
6. Tin and Tin Alloys for Lead-Free Solder
7. Electrodeposition of Chromium
8. Electrodeposition of Lead and Lead Alloys
9. Electrodeposition of Tin-Lead Alloys
10. Electrodeposition of Zinc and Zinc Alloys
11. Electrodeposition of Iron and Iron Alloys
12. Palladium Electroplating
13. Electrochemical Deposition Process for ULSI Interconnection Devices
14. Electrodeposition of Semiconductors
15. Deposition on Nonconductors
16. Conductive Polymers: Electroplating of Organic Films
17. Electroless Deposition of Copper
18. Electroless Deposition of Nickel
19. Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems
20. Electroless Deposition of Palladium and Platinum
21. Electroless Deposition of Gold
22. Electroless Deposition of Alloys
23. Preparation for Deposition
24. Manufacturing Tools
25. Monitoring and Control
26. Environmental Aspects of Electrodeposition
27. Applications to Magnetic Recording and Microelectronic Technologies
28. Microelectromechanical SystemsvAnalysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques
29. Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates

Index

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