Printed Circuits Handbook
Sixth Edition
by Clyde F. Coombs, Jr.

Printed Circuits Handbook contains definitive coverage of every facet of printed circuit assemblies—from design methods to fabrication processes.

Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.

Printed Circuits Handbook Sixth Edition contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more.

This updated Printed Circuits Handbook provides you with:

• Unsurpassed guidance on printed circuits_from design to manufacturing
• Over 500 illustrations, charts, and tables for quick access to essential data
• New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits

Contents

Part 1: Lead-Free Legislation

1. Legislation and Impact on Printed Circuits

Part 2: Printed Circuit Technology Drivers

2. Electronic Packaging and High-Density Interconnectivity
3. Semiconductor Packaging Technology
4. Advanced Component Packaging
5. Types of Printed Wiring Boards

Part 3: Materials

6. Introduction to Base Materials
7. Base Material Components
8. Properties of Base Materials
9. Base Materials Performance Issues
10. The Impact of Lead-Free Assembly on Base Materials
11. Selecting Base Materials for Lead-Free Assembly Applications
12. Laminate Qualification and Testing

Part 4: Engineering and Design

13. Physical Characteristics of the PCBM
14. The PCB Design Process
15. Electrical and Mechanical Design Parameters
16. Current Carrying Capacity in Printed Circuits
17. PCB Design for Thermal Performance
18. Information Formatting and Exchange
19. Planning for Design, Fabrication, and Assembly
20. Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly
21. Embedded Components

Part 5: High Density Interconnection

22. Introduction to High-Density Interconnection (HDI) Technology
23. Advanced High-Density Interconnection (HDI) Technologies

Part 6: Fabrication

24. Drilling Processes
25. Precision Interconnect Drilling
26. Imaging
27. Multilayer Materials and Processing
28. Preparing Boards for Plating
29. Electroplating
30. Direct Plating
31. PWB Manufacture Using Fully Electroless Copper
32. Printed Circuit Board Surface Finishes
33. Solder Mask
34. Etching Process and Technologies
35. Machining and Routing

Part 7: Bare Board Test

36. Bare Board Test Objectives and Definitions
37. Bare Board Test Methods
38. Bare Board Test Equipment
39. HDI Bare Board Special Testing Methods

Part 8: Assembly

40. Assembly Processes
41. Conformal Costing

Part 9: Solderability Technology

42. Solderability: Incoming Inspection and Wet Balance Technique
43. Fluxes and Cleaning

Part 10: Solder Materials and Processes

44. Soldering Fundamentals
45. Soldering Materials and Metallurgy
46. Solder Fluxes
47. Soldering Techniques
48. Soldering Repair and Rework

Part 11: Nonsolder Interconnection

49. Press-Fit Interconnection
50. Land Grid Array Interconnect

Part 12: Quality

51. Acceptability and Quality of Fabricated Boards
52. Acceptability of Printed Circuit Board Assemblies
53. Assembly Inspection
54. Design for Testing
55. Loaded Board Testing

Part 13: Reliability

56. Conductive Anodic Filament Formation
57. Reliability of Printed Circuit Assemblies
58. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
59. Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders

Part 14: Environmental Issues

60. Process Waste Minimization and Treatment

Part 15: Flexible Circuits

61. Flexible Circuit Applications and Materials
62. Design of Flexible Circuits
63. Manufacturing of Flexible Circuits
64. Termination of Flexible Circuits
65. Multilayer Flex and Rigid/Flex
66. Special Constructions of Flexible Circuits
67. Quality Assurance of Flexible Circuits

Index

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