Wafer Bonding
Applications and Technology
edited by M. Alexe

This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia.

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.

The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Contents

1. Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
2. Basics of Silicon-on-Insulator (SOI) Technology
3. Silicon-on-Insulator by the Smart Cut Process
4. ELTRAN Technology Based on Wafer Bonding and Porous Silicon
5. Wafer Bonding for High-Performance Logic Applications
6. Application of Bonded Wafers to the Fabrication of Electronic Devices
7. Compound Semiconductor Heterostructures by Smart Cut SiC on Insulator, QUASIC Substrates, InP and GaAs Heterostructures on Silicon
8. Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
9. Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
10. High-Density Hybrid Integration of III-V Compound Optoelectronics with Silicon Integrated Circuits
11. Layer Transfer by Bonding and Laser Lift-Off
12. Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
13. Wafer Bonding of Ferroelectric Materials
14. Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications

Index

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